X-ray non-destructive testing system EFPscan-2000

EFPscan-2000 is suitable for high-resolution and fast 3D tomography detection of large-area plate samples EFPscan-2000 is a 3D X-ray testing system for PCBA and IGBT field. It adopts advanced Computed Laminography (CL) scanning mode and reconstruction algorithm and can be used off-line and on-line to test the whole plate. It is suitable for testing electronic devices such as BGA/LGA, pressfit connector, Flip chip, PoP, QFN, PTH and IGBT to find defects such as pores, open circuits, bridging, head-in-pillow, poor wetting, missing parts, and wrong parts inside the device. ●Fastest CT imaging of a FOV area completed in 5 seconds ●Integrity and high resolution for large-sided plate sample ●Programmable scanning process to simplify the workload of operators ●Dedicated automatic identification algorithm to quantitatively count the defects inside the device