COM-HPC computer-on-module SOM-COM-HPC-A-TGL-H
Intel® Xeon® vPRO®Intel® Xeon® W-11000E11th Generation Intel® Core™

COM-HPC computer-on-module
COM-HPC computer-on-module
COM-HPC computer-on-module
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Characteristics

Form factor
COM-HPC
Processor
Intel® Xeon® vPRO®, Intel® Xeon® W-11000E, 11th Generation Intel® Core™
Ports
HDMI, DisplayPort, USB 2.0, USB 3.0, USB 3.2, SO-DIMM
Operating system
Yocto, Android, Windows 10 IoT Enterprise

Description

COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. CPU 11th Gen Intel® Xeon®, Core™ and Celeron® processors Graphics Intel® Iris Xe Graphics Core Gen12 GPU with up to 32 EU, up to 4 independent displays Connectivity 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE Memory Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

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