The advantages of laser
Allows point by point adjustment of the power needed for soldering; the lack of thermal inertia of the laser combined with real-time temperature readings, enable the dynamic correction of the thermal profile.
Allows point by point adjustment of the power needed for soldering; the lack of thermal inertia of the laser combined with real-time temperature readings, enable the dynamic correction of the thermal profile.
The orthogonal position improves the energy transferm The donut beam allows to radiate energy only on the pad and not on the hole, preventing damages to components and harmonizing the temperature of pin and pad.
The ability to apply all of the energy in a single point makes this technology applicable in all those situations where it is not admissible to heat the whole board, or where there is limited access.
Changing from “Lead” to “Lead-Free” soldering is simply a matter of changing a spool of solder wire.
The laser soldering process is clean, which eliminates the need to clean, and subsequently handle, the processed boards, and the power consumption of the Firefly is extremely low compared to other types of soldering technologies.
The Firefly systems are ready to solder as soon as they are switched on, without preheating, making them an extremely flexible tool in a manufacturing environment.