Digital camera SDV series

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Overview
This camera integrates Sony InGaAs sensors (SONY IMX990 / SONY IMX991) introduced in May 2020 and provides sensitivity from visible to short-wave infrared (400 nm–1700 nm). It is designed for industrial SWIR imaging such as back-side inspection of silicon wafer patterns and IR microscopy.

USB3 Type (summary)
Model: SDV-990A-USB3 / SDV-991A-USB3
Sensor: SONY IMX990 / SONY IMX991
Resolution: 1280(H) x 1024(V) / 640(H) x 512(V)
Pixel size: 5 µm x 5 µm
Scan area: 6.4 mm x 5.12 mm (Diagonal = 8.2 mm) / 3.2 mm x 2.56 mm (Diagonal = 4.1 mm)
Interface: USB3.0
Shutter: Global shutter
Wavelength range: 400 nm – 1700 nm
Frame rate: 12-bit (up to 72 fps for IMX990; up to 137 fps for IMX991)
SNR: 51 dB
Power: DC 12V input
Lens mount: C mount
Operating temperature: 10 – 40 °C
Storage temperature: 0 – 60 °C
Dimensions: 71.6 (W) x 61.5 (H) x 78.0 (D) mm (excluding protrusions)

Camera Link Type (summary)
Model: SDV-990A-CL / SDV-991A-CL
Sensor: SONY IMX990 / SONY IMX991
Resolution: 1280(H) x 1024(V) / 640(H) x 512(V)
Pixel size: 5 µm x 5 µm
Scan area: 6.4 mm x 5.12 mm (Diagonal = 8.2 mm) / 3.2 mm x 2.56 mm (Diagonal = 4.1 mm)
Interface: Camera Link
Output connector: SDR26pin
Shutter: Global shutter
Wavelength range: 400 nm – 1700 nm
Exposure time: 20.3 µs – 2 s
Frame rate: 12-bit (up to 72 fps for IMX990; up to 137 fps for IMX991)
SNR: 51 dB
Power: DC 12V input
Lens mount: C mount
Operating temperature: 10 – 40 °C
Storage temperature: 0 – 60 °C
Dimensions: 71.6 (W) x 61.5 (H) x 78.0 (D) mm (excluding protrusions)

Graph and Usage Examples
The product page provides a graph of relative quantum efficiency versus wavelength for the IMX990/IMX991 sensors. Typical use cases include IR microscopy and back-side imaging of silicon wafers under varying illumination conditions.

Characteristics / technical specifications

• Sensor types: SONY IMX990 (1.3MP) and SONY IMX991 (0.32MP)
• Sensor technology: InGaAs (SWIR sensitive)
• Wavelength sensitivity: 400 nm – 1700 nm
• Resolutions: 1280 x 1024 (IMX990), 640 x 512 (IMX991)
• Pixel size: 5 µm x 5 µm
• Scan areas: 6.4 mm x 5.12 mm (IMX990), 3.2 mm x 2.56 mm (IMX991)
• Interfaces: USB3.0 (SDV-990A-USB3 / SDV-991A-USB3) and Camera Link (SDV-990A-CL / SDV-991A-CL)
• Output connector (Camera Link): SDR26pin
• Shutter: Global shutter system
• Frame rate / bit depth: 12-bit; up to 72 fps (IMX990) and up to 137 fps (IMX991)
• SNR: 51 dB
• Exposure time (Camera Link): 20.3 µs – 2 s
• Power: Input voltage DC 12V
• Lens mount: C mount
• Operating temperature: 10 – 40 °C
• Storage temperature: 0 – 60 °C
• Dimensions: 71.6 (W) x 61.5 (H) x 78.0 (D) mm (excluding protrusions)
• Primary application example: Back-side inspection of silicon wafer patterns; IR microscopy and other SWIR imaging tasks