HFC HFS-18 is a high-efficiency thermally conductive gasket with good thermal conductivity and low thermal resistance, which can effectively fill the gap between the heating end and the cooling end, and achieve efficient heat transfer between the heating part and the cooling part Amplitude reduces interface thermal resistance. At the same time, the high-efficiency heat sink can also be used under lower stress conditions to avoid damage to chips, PCBs and other components from mounting stress. The product is extremely technical and usable, and can be used in devices such as photovoltaic modules and Netcom that require .
● High thermal conductivity and low thermal resistance
● Low stress assembly
● Good thermal stability
● Multiple thickness options, wide range of applications
radar and other military fields
Between chip and heat-dissipation modules