The high data rates and miniature scale of high-speed electronics require high signal and power integrity (SI/PI), with a low risk of interference or noise. As data rates increase, the signal frequency increases and signals propagate more like a high-frequency electromagnetic wave than a classical circuit current. Understanding the behavior of high-speed electronics goes beyond circuit simulation: it requires a full-wave 3D approach that can model these electromagnetic fields fully to help analyze the design of high-performance printed circuit boards.
Simulation in the EDA workflow
The “Virtual Twin” approach can replicate physical tests in the simulation environment. A Virtual Twin is a high-fidelity model of the system that includes all relevant data in one package. Common SI/PI tests such as IR drop, eye diagram and bathtub plots can be replicated virtually, as can electromagnetic compatibility (EMC) test set-ups such as emissions measurement and bulk current injection (BCI).
Trustworthy Virtual Twins require accurate models. SIMULIA offers access to material databases with the properties of real proprietary substrates, and the ability to create custom materials from measured data using various material property models, such as frequency-dependent materials.
The electromagnetic simulation tools in CST Studio Suite can be integrated into EDA workflows using many industry-standard ECAD and MCAD tools, offering electronic engineers the ability to analyze SI/PI and EMC concerns at all phases of design: pre-layout, during layout and post-layout.