Nickel metallization

plasticfor electronics

Deposition of metals – Cu, Ni, Sn, Ag – electroless on plastic parts to achieve a high degree of shielding from electromagnetic interference. The coating can be total or selective, only on specific parts of the product. For electronics, telecommunications, industrial automation. In addition to chemical metal deposition processes, there are also conductive coatings with high precision spray application. Metal Deposition, Sive’s Technologies The technology of chemical (electroless) metallization on plastic parts is one of Sive’s historical treatments. It is a complex process developed in the 1990s to meet the high standards of electromagnetic interference (EMI) shielding required by clients such as Schneider Electric for its developing PLC systems. Since then, continuous evolution of the technology and the chemical metallization process have not only allowed us to stay in the market but to acquire new customers and provide increasingly precise custom solutions. The process offers the possibility of depositing thin layers of metals such as Copper (Cu), Nickel (Ni), Tin (Sn) on plastic components, even selectively, i.e., only on certain parts of the component. Currently, Sive is the only company in Europe to apply this chemical metallization process, which guarantees an excellent level of electromagnetic interference shielding. Advanced Application of Conductive Coatings In addition to chemical metallization processes, Sive has perfected the technique of applying conductive coatings based on silver (Ag), copper (Cu), nickel (Ni), through spraying.