Silicon diamond wire

for ceramicsfor graphitefor quartz

Manufacturer of diamond slicing wire. Diameter range from 60 µm to 400 µm. Key benefit -- reduced cost of ownership! Faster cut times: 6 - 8 times faster than slurry, application dependent Increased capacity with lower capital expenditures Faster ROI to justify initial capital investment Roadmap to lower wafer cost and higher throughput: Lower cost from reduced total cost of ownership Less expensive secondary process costs Re-use of wire Reduced utilities Reduce production complexity: Reduced running costs such as electricity and cooling water Bundled consumables for optimized processing