Enterprise Applications, Scale-Out Object Storage, Cloud Computing, Compact Server, Web/Hosting Application, Cloud Gaming, MEC (Multi-Access Edge Computing), Multi-Purpose CDN, Telco Edge Cloud, Mission Critical Web Applications, IoT Edge Computing / Gateway, Edge AI Inferencing,
Key Features
1 PCIe 5.0 x16 LP slot(offering with 4x E1.S drives), or 1 OCP3.0 slot (offering with 2x U.2 drives) for networking expansions;
GrandTwin front IO module offers additional networking options (10G/25G/200G) with NCSI support;
Single-Socket, Intel® Xeon® 6 6700 series processors with E-cores;
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:;
Form Factor
Enclosure: 449 x 88 x 711.2mm (17.67" x 3.46" x 28")
Package: 626 x 248 x 1150mm (24.65" x 9.76" x 45.28")
Up to 144C/144T; Up to 108MB Cache
System Memory Slot Count: 16 DIMM slots/2 Channels
Drive Bays Configuration Default: Total 8 bays
8 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays
Option A: Total 4 bays
4 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays
Option B: Total 4 bays
4 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays
Option C: Total 2 bays
2 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays
Expansion Slots PCI-Express (PCIe) Configuration:
Default*
1 PCIe 5.0 x16 LP slot
(*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot
configuration options, please refer to the system callout images above.)
M.2: 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID)
On-Board Devices NVMe: NVMe; RAID 0/1/5/10 support(VROC HW key required)
Chipset: System on Chip
Network Connectivity: Via IO Module