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- Brazing paste
- TAMURA CORPORATION OF CHINA LIMITED
Solder paste DF for electrical components
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Characteristics
- Function
- solder
- Applications
- for electrical components
Description
Solder paste for semiconductor bump formation using fine powder with reduced alpha radiation, suitable for dry film printing processes.
Product Features
Supports bump formation for ~60µm pitch bumps using dry film resist.
Complies with IPC's halogen-free standards (Br,Cl content in paste ≥900ppm, total ≥1500ppm).
Low alpha-compatible.
Supports C4 bumps and C2 bumps.
Reduces bump height variation.
Main Applications
Semiconductor Packages
Catalogs
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See all of TAMURA CORPORATION OF CHINA LIMITED‘s catalogs*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.