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- Film for automotive applications
- TAMURA CORPORATION OF CHINA LIMITED
Sheet for automotive applications
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Characteristics
- Applications
- for automotive applications
Description
For power semiconductor applications in EVs and industrial equipment.
Product Features
Bonding of DBC substrates and heat sinks.
Achieving low void formation using a vacuum reduction furnace.
Pressure-free bonding possible.
Bonding of next-generation power devices such as SiC, GaN, Ga₂O₃, which operate at high temperatures.
Main Applications
Motor Control Inverters
Semiconductor Packages
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See all of TAMURA CORPORATION OF CHINA LIMITED‘s catalogs*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.