adhesive label / identification / barcode / thermal transfer
TSK Series

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Characteristics

  • Type:

    adhesive, thermal transfer, identification, barcode

  • Material:

    polyimide

  • Product applications:

    for electronic components, printed circuit

  • Other characteristics:

    high-temperature

  • Thickness:

    118 µm

Description

TE’s polyimide labels are all ideal for high temperature labelling requirements such as printed circuit boards. They are suitable for direct wave (bottom side) and IR reflow (top side) PCB applications. TE’s polyimide labels are designed to withstand the fluxes, cleaning solvents and molten solder encountered in the manufacture of printed circuit boards. They offer excellent contrast for bar code applications. TE’s polyimide labels are suitable for the harshest high temperature applications.

Features and benefits
• TSK is deemed to be a Static Safe product in accordance with EIA 625, EIA 541. Test methods were in accordance with EOS/ESD S11.11.
• Thermal transfer printable
• High opacity gloss white topcoat
• Withstands surface mount board processes on either the top or bottom side of the board
• Static dissipative label, designed to withstands harsh fluxes, cleaners, saponifiers and wave solder environment

Operating temperature ranges
100 Hours: -40°C to 150°C (-40°F to 302°F)
5 Minutes: -40°C to 260°C (-40°F to 500°F)
90 Seconds: -40°C to 300°C (-40°F to 572°F)

Label thickness
118μm (0.0046”)

Adhesive
High Temperature Permanent Acrylic Adhesive

Specifications and approvals
UL969 PGJI2 MH17292
EIA 541& EIA 625
EOS/ESD S11.11
MIL-STD-202 Method 215
ASTM-D2979

Recommended hardware and software
Printer: T200-IDENT / TE3112 / TE3124
Ribbon: 1330-0619-10
Software: WinTotal v6 or PrintEasy v5

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