5 inch (125 mm) silicon wafer

6 inch (150 mm)200 mm (8 inch)4 inch (100 mm)

Outline
Ultrapure silicon parts designed for semiconductor manufacturing and evaluation. Products are produced under Cross-edge technology and a strict quality assurance system to meet front‑end and process‑integration requirements.

Major advantages

• Material: ultrapure silicon (monocrystalline / polycrystalline) to minimize contamination risk.
• Thermal properties consistent with silicon wafers (thermal conductivity, specific heat, coefficient of thermal expansion), reducing damage and improving yield and productivity.
• Excellent thermal conductivity ensures uniform and stable film-thickness distribution.
• High heat- and corrosion-resistance for improved durability in high-temperature processes.
• High-precision machining for complex shapes to meet diverse equipment requirements.
• Single-material construction avoids coating delamination and associated contamination risks.

Silicon products (examples)
CVD susceptors, rings for various equipment | Focus rings | Cleaning jigs
Wall plates for implantation domes | Tubes | Pins
Optical waveguide wafer jigs for various devices | Tables | Nozzles

Silicon wafer for dicing test
Silicon wafers for pre-dicing, experiments and evaluation purposes are available.

Standard specifications
Surface: mirror finish on one side. Available diameters and thickness options:
Diameter — Thickness (μm):
4 in — ① 400–700 | ② 500±25 | ③ 530±25
5 in — ① 500–700 | ② 550±25 | ③ 625±25
6 in — ① 500–700 | ② 450±50 | ③ 625±25
8 in — ① 725±? | ② 725±50
12 in — ① 775±50
Regular package style: coin stack. Case delivery available on request.

Others
Particle-controlled wafers for front-end use available (particle spec.: fewer than 30 particles >0.2 μm), subject to specification.

Samples of processed silicon/ceramics products
High‑precision machining services for Si, Al2O3, AlN, sapphire and similar materials. Examples: bar dicing down to ~100 μm with chipping suppression; burr‑reduced dicing of metalized ceramics.

Technical characteristics / specifications

• Material: Ultrapure silicon (monocrystal / polycrystal).
• Surface finish: one-side mirror / one-side etched options.
• Diameter support: 4 in, 5 in, 6 in, 8 in, 12 in.
• Thickness options: see standard specifications above (μm, diameter-dependent).
• Applications: CVD susceptors, focus rings, cleaning jigs, implantation-dome wall plates, tubes, pins, optical waveguide wafer jigs, tables, nozzles, dummy wafers.
• Processing capability: high-precision and complex-shape machining; fine dicing to ~100 μm; burr reduction on metalized ceramics.
• Particle-controlled wafers: available for front-end use (≤30 particles >0.2 μm) upon request.
• Packaging: standard coin stack; case delivery available depending on order specification.