SMT pick-and-place machine H80

benchtop

Pick and Place Option This cost-effective extension kit transforms all TPT Wire Bonder models into a functional die bonder. One Bond Head even for Die Bonding Applications The H80 Pick & Place extension kit does not require a bond head change. Fast and easy change of bond tools lets you switch from die bonding to wire bonding and back. Bond Time programmable up to 5000ms There are no limitations planning and bonding die bonding tasks. It is the best way to meet individual epoxy needs. Bond Force programmable up to the centinewton With the 6,5“ Touchscreen bond force is programmable from 10 centinewton to 150 centinewton . 6 to 1 Manipulator - intuitiv and precise Working with the H80 Pick & Place extension kit benefits of the advantage of working with our sophisticated bond table technology. Its transmission is 6to1.