X-ray inspection machine TR7600LL SV

optical3DCT

Introduction
The TR7600 SV series is a line-scan 3D AXI optimized for high-resolution PCB inspection. Compared with the TR7600 SIII series, it provides up to 20% performance improvement. AI-powered algorithms enable precise void detection and high-yield inspection at 7 µm resolution.

Supported parts / Robust platform
The platform supports fast image reconstruction and defect detection for a wide range of components including:

• BGAs
• Barrel fill
• Capacitors
• Chips / LED chips
• Components under RF shields
• CSPs
• DIMM connectors
• Flip-chips
• Ground pads
• Gullwing / J-leads
• Heat sinks
• LGAs
• Paladin connector
• Resistors / RNET
• SiP / SMT connectors / SOIC / SOT
• Thermal pads
• QFNs / QFP / THTs

Features

• 7 µm high-performance inspection with up to 20% throughput improvement vs previous model
• New EtherCAT motion controller for real-time measurement and simplified maintenance
• AI-powered inspection algorithms for accurate defect classification
• Smart Factory ready — MES connectivity supported
• Worldwide technical support services

Imaging System
Camera: Ultra-high speed line-scan CCD — 3 or 5 units (9 or 15 sensors)
X-ray source voltage: 60–130 kV
Imaging resolution: 7 μm–25 μm (7 μm high-performance option)
Inspection methods: 2D, 2.5D, 3D slicing; Planar CT (optional)


Motion Table & Control
X-axis: Linear servo motor with motion controller (EtherCAT)
Y-axis: High-precision dual-driven ball screw + AC-servo controller
Z-axis: High-precision ballscrew + AC-servo controller
X–Y axis resolution: N/A


Board Handling
Max PCB size: TR7600 SV: 950 x 520 mm; TR7600LL SV: 1000 x 660 mm
PCB thickness: 0.4–7 mm
Max PCB weight: 12 kg
Top clearance: @25 μm: 50 mm; @20 μm: 50 mm; @15 μm: 30 mm; @10 μm: 15 mm; @7 μm: 7 mm
Bottom clearance: @7/10/15/20 μm — TR7600 SV: 80 mm; TR7600LL SV: 70 mm; @25 μm: 55 mm
Edge clearance: 3 mm or 5 mm
Conveyor height: 880–920 mm (optional 940–965 mm)


Inspection Functions
Capabilities

• Missing
• Misalignment
• Tombstone
• Billboard
• Tantalum polarity
• Rotation
• Floating

Detected defects

• Insufficient / excess solder
• Bridging
• Open
• Solder ball
• Non-wetting
• Void
• Lifted lead

Dimensions
Machine WxDxH: TR7600 SV: 1600 x 2100 x 1800 mm; TR7600LL SV: 1730 x 2300 x 1975 mm
Signal tower height (not included): 519 mm
Weight: TR7600 SV: 3,350 kg; TR7600LL SV: 4,900 kg
Power: 200–240 VAC single phase, 50/60 Hz, 4 kVA


Technical specifications

• Model: TR7600 SV (TR7600LL SV variant available)
• Technology: Line-scan 3D AXI with AI-powered algorithms
• Camera: Ultra-high speed line-scan CCD (3 or 5 units; 9 or 15 sensors)
• X-ray source: 60–130 kV
• Imaging resolution: 7 μm–25 μm
• Inspection methods: 2D, 2.5D, 3D slicing; Planar CT optional
• Max PCB size: 950 x 520 mm (TR7600 SV) / 1000 x 660 mm (TR7600LL SV)
• PCB thickness: 0.4–7 mm; max weight: 12 kg
• Top/bottom clearance: see Board Handling section
• Edge clearance: 3 mm or 5 mm
• Conveyor height: 880–920 mm (optional 940–965 mm)
• Motion control: EtherCAT motion controller; X linear servo; Y dual-driven ball screw + AC-servo; Z high-precision ballscrew + AC-servo
• Dimensions & weight: see Dimensions
• Power: 200–240 VAC single phase, 50/60 Hz, 4 kVA