Product DescriptionThe TSM Thickness Profile Measurement System (GPA EVO II) is an offline, laboratory-grade film thickness profiler for blown and cast film manufacturers. It combines non-contact capacitive and micrometer sensors with automated calibration and the integrated GPA-Win software to deliver repeatable, micron-level measurements across the full film profile. The system is designed for QA, laboratory testing and process validation, enabling independent thickness verification to support production control and compliance with ISO/DIN standards.
Key Features- Measurement Type: Offline thickness profile measurement for blown and cast film applications
- Measurement Accuracy: ±0.2 μm for precise and repeatable gauge validation
- Sensor Resolution: 0.05 μm for detailed thickness profile analysis
- Calibration System: Automatic zero reset to ensure consistent baseline accuracy
- Sensor Technology: Non-contact capacitive and micrometer sensors for low-wear, reliable operation
- Software Interface: Integrated GPA-Win with profile visualisation and reporting tools
- Measurement Flexibility: Suitable for varying film lengths and production requirements
- Film Handling: Support rack with rollers for stable, controlled sample movement
- Connectivity: LAN interface for PC integration and structured data management
- Compliance: Designed to support ISO and DIN quality assurance standards
Technical specifications- Film Sample Width: 100 mm
- Maximum Sample Length: 19.99 m
- Measuring Speed: 15–80 mm/s
- Measuring Range: 0–300 μm
- Sensor Resolution: 0.05 μm
- Measuring Accuracy: ±0.2 μm
- Pressure Force: 0.3–0.5 N
- Interface: 1 x LAN (PC)