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Digital camera module COIN412/Rthermalimage processinginfrared
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Characteristics
- Technology
- digital
- Function
- thermal, image processing
- Spectrum
- infrared
- Other characteristics
- lightweight, OEM, outdoor, uncooled
Description
WLP+ASIC Uncooled Thermal Modules
COIN series uncooled thermal module integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.
400x300IR resolution
12μm Pixel Pitch
＜3s Start-up Time
＜40mKNETD
（1）“Minimum size and weight”
• Dimension 20mm*20mm*10.4mm，Weight＜8g.
（2）“Sharp image presentation”
• NETD＜40mK；
• NUC、IDE、AGC intelligient algorithm.
（3）“Fast integration
• DVP/LVDS interface，raw/YUV image data output, serial port control.
Catalogs
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.