Data connector Y-SPE2-J9STTMP-11-NOALR1T

screwlockingpush-pull

Mating face according to IEC 63171-2 90° version for THR soldering Small in size and weight Future oriented technology towards industry 4.0 Transmission lengths of up to 1,000 m and transmission rates up to 10 GB/s Additional power transmission up to 50 W via Power over Data Line (PoDL) possible Mating faces of sub-standards IEC 63171-2 /-5 /-6 /-7 with IP20 or IP6X solutions available M12 based connectors with screw or Push-Pull locking mechanism (acc. IEC 61076-2-012) Mating Cycles 1,000 Plating type, technology and coating thickness In contact area:Min 30μ’’ Au over min 60μ’’ Ni In soldering area:Min.80μ’’ Sn over min.60μ’’Ni Packaging Tray Contact Type Solder (Initial) Contact Resistance 10 Milliohm at 3 A Insulation Resistance 500 Milliohm at 500 (Dieletric) Withstanding Voltage 1000 V DC for 1 minute pin to pin Current Rating 3 A 1 minute pin to shield/ground Soldering Technology THR & SMD In case of THR or SMD: according to J-STD-020D or newer Pin Count / Numbers of pins 2 Contact Type Solder