Body temperature camera module G1 series

digitalimage processingthermal imaging

G1 Series Uncooled Thermal Module employs Infisense's self-developed ASIC infrared image processing chip, replacing the FPGA of traditional thermal imaging modules. With full-series 12μm VOx ceramic packaged detectors, it provides high-quality infrared images and high-accuracy temperature measurement functions, and features a combination of high performance, compactness, lightweight, low power consumption, and low cost, meeting the application requirements of SWAP3 (Size, Weight and Power, Performance, Price). Resolution: 384×288/640×512/1024×768/1280×1024 Pixel size: 12μm Detector package: Ceramic package Rich and flexible interfaces, easy to integrate Support DVP concurrent digital video output, SPI video transmission, and I2C and UART interfaces. Support digital video formats such as RAW14, YUV, Y8, BT.656, BT.1120, and LVCMOS. Support simultaneous output of image data + temperature data. Integrate MCU internally and provide secondary development SDKs. Small size, low power, and light weight Benefiting from the compactness and high integration of ASIC, the module size is greatly reduced (26mm×26mm for the 384×288/640×512 module and 42mm×42mm for the 1024×768/1280×1024 module). Benefiting from ASIC, the module power consumption is extremely low (384×288/640×512 module:<500mW, 1024×768/1280×1024 module: <1W). The ASIC-based thermal module has only one circuit board, greatly reducing the weight (384×288/640×512 module:<18g, 1024×768/1280×1024: <75g). Self-developed core The core processor adopts Infisense's self-developed ASIC infrared processing chip, which is only 1/6 of the size and 1/3 of the power consumption of traditional FPGA,