LED display PCB

Mini LED PCB. The light source has been shortened by shortening the pad gap to 15~32 microns, and BT packaging substrate materials have been applied. It can achieve a more finely pixelated dynamic backlight effect, effectively improve the screen brightness and contrast, and adapt to the current product requirements and trends Product Feature Smaller pad width, no color deviation, the best substrate for illumination. With mSAP process, best solution for MiP applications. Various high-end material selections for all kinds of design applications