Shenzhen DeepMaterial Technologies Co., Ltd

Who we are

Deepmaterial is reactive hot melt pressure sensitive adhesive manufacturer and supplier, manufacturing one component epoxy underfill adhesives, hot melt adhesives glue, uv curing adhesives,high refractive index optical adhesive, magnet bonding adhesives, best top waterproof structural adhesive glue for plastic to metal and glass, electronic adhesives glue for electric motor and micro motors in home appliance.

Deepmaterial is high temperature uv cure silicone adhesive sealant epoxy manufacturers and flexible uv curable uv curing optical adhesive glue supplier in uv adhesives industry,in uv light curing adhesives market,we supply uv curing plastic bonding adhesives,structural uv-curing adhesives,best top waterproof structural uv adhesive glue for plastic to metal and glass and so on.

Shenzhen DeepMaterial Technologies Co., Ltd is an innovative company specializing in industrial epoxy adhesives for semiconductor,home applicance and electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed industrial underfill epoxy adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.

To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance. Domestic substitution demand for protection, optical protection, etc.

Our values

Deepmaterial provide customized adhesive services on your demand,including custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional protective film, semiconductor protective film. We engaged in the research and development and application of glue in the fields of consumer electronics, medical equipment, aerospace, optoelectronic energy, auto parts, semiconductor chips, etc. The R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.