Light cure adhesive DYMAX

UV curable Adhesives, UV curable conformal coatings and UV curable encapsulants for electronic materials assembly cure upon exposure to ultraviolet light in seconds. DYMAX solvent-free UV curable adhesives, conformal coatings and encapsulants are ideal for circuit board assembly, flex circuit encapsulation, peelable and water soluble masking, tamper-proofing, potting and strain relief. IPC MIL Spec and UL approved and multiple viscosity grades of these adhesives, conformal coatings, masks and encapsulants are available.

DYMAX UV curable conformal coatings can be applied over the entire PCB surface or discreet areas to provide complete protection from harsh environments or solvents. UV curable Encapsulants protect components on rigid or flexible boards to -40°C. UV curable peelable and water soluble masks are easy to apply and remove, and are designed for manual or fully automated masking of printed circuit boards prior to wave solder or reflow operations. One-part and two-part potting compounds can achieve full cure in seconds and dramatically reduce cycle times and costs. DYMAX UV curable thermally conductive adhesives transfer more heat and bond faster than competitive products.

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