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Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical ...
Master Bond
Two component, thermally conductive, electrically insulative epoxy system Key Features * Low exotherm * Excellent flow properties * Superior dimensional stability * Well suited for large potting applications Master ...
Master Bond
Key Features • Room temperature curing • Low shrinkage upon cure • Very low coefficient of thermal expansion • Superior dimensional stability • Passes fungus resistance MIL-STD-810G • Withstands 1,000 hours 85°C/85% RH Master ...
Master Bond
... temperature resistant • Thermally conductive • Tough and flexible • Easy to apply and doesn’t require freezing • Excellent electrical insulation properties • Uniform bond line thickness Master ...
Master Bond
... prominent use is as a glob top material, it also can be utilized as a die attach, potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA ...
Master Bond
Key Features - Available in 30 gram preforms - High temperature resistant - Thermally conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - ...
Master Bond
... type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant in electronic and related applications, where high temperature resistance, good ...
Master Bond
... color. As mentioned above, this multifaceted system can be used as a glob top or die attach and in other applications as an adhesive or sealant in electronics when the special combination of properties, particularly the ...
Master Bond
Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has a 100:60 ...
Master Bond
... a specialty formulation that can be used for bonding, coating, sealing and encapsulation. When used as an adhesive, the thermally conductive filler has very fine particle sizes; subsequently, ...
Master Bond
... that aid in lessen thermal impedance. The epoxies and urethanes from our line of thermally conductive adhesives are suitable for operations that need extremely strong adhesive ...
... electronics, aerospace, major OEM and similar applications. discuss_app discuss_app discuss_app Product Highlights Thermally conductive Lower exotherm while curing Expeditious cures at 80°C or ...
Kohesi Bond
... and microelectronics packaging and assembly applications. discuss_app discuss_app discuss_app Product Highlights Thermally conductive Castable up to 1 inch thicknesses Rapid cures at elevated ...
Kohesi Bond
Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), ...
Kohesi Bond
Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for ...
Kohesi Bond
... remarkable performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. Product Highlights Low ionic content ...
Kohesi Bond
... it suitable for use in various other electronics, aerospace and distinctive OEM applications. Product Highlights Thermally conductive Low ionic content Extremely fast cure Outstanding dimensional ...
Kohesi Bond
Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working ...
Kohesi Bond
Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher ...
Kohesi Bond
Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical ...
Kohesi Bond
... formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive ...
Kohesi Bond
Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent ...
Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to the heat sink with a controlled gap. Dissipator® 745, through ...
DYMAX Multi-Cure® thermal interface materials may be cured with light, heat, or activator. Most applications utilize a combination of these methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing ...
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