Thermally-conductive adhesives

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epoxy adhesive
epoxy adhesive
EP3HTS-TC

Working temperature: -80 °F - 400 °F

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at ...

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Master Bond
silicone adhesive
silicone adhesive
MasterSil 153AO

... The system is thermally conductive and electrically insulating. “The key feature of MasterSil 153AO is that it provides the ability to minimize stress, with no compromise on strength. Although it is ...

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Master Bond
two-component adhesive
two-component adhesive
EP30LTE-LO

Key Features • Room temperature curing • Low shrinkage upon cure • Very low coefficient of thermal expansion • Superior dimensional stability • Passes fungus resistance MIL-STD-810G • Withstands 1,000 hours 85°C/85% RH Master ...

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Master Bond
urethane adhesive
urethane adhesive
TC series

... that aid in lessen thermal impedance. The epoxies and urethanes from our line of thermally conductive adhesives are suitable for operations that need extremely strong adhesive ...

epoxy adhesive
epoxy adhesive
KB 1613 R80

... electronics, aerospace, major OEM and similar applications. discuss_app discuss_app discuss_app Product Highlights Thermally conductive Lower exotherm while curing Expeditious cures at 80°C or ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
KB 1613 RLV

... and microelectronics packaging and assembly applications. discuss_app discuss_app discuss_app Product Highlights Thermally conductive Castable up to 1 inch thicknesses Rapid cures at elevated ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
TUF 1613 HT-CM

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), ...

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Kohesi Bond
acrylic adhesive
acrylic adhesive

DYMAX Multi-Cure® thermal interface materials may be cured with light, heat, or activator. Most applications utilize a combination of these methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing ...

silicone adhesive
silicone adhesive
Dissipator® 746

... Hernon® Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with ...

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Hernon Manufacturing
conductive adhesive
conductive adhesive

Conductive glue RTV GLUES The RTV silicone glues are loaded with metallic particles. The flexibility of these materials can absorb shocks and vibrations during an embedded ...