Thermally-conductive adhesives

Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h

... conductivity: 41.6–45.1 BTU·in/(ft²·hr·°F) [6.0–6.5 W/(m·K)]

Product Description
EP54TC is a thermally conductive, electrically insulating two-part epoxy with a 100:5 mix ratio by weight and ...

... Key Features • Room temperature curing • Low shrinkage upon cure • Very low coefficient of thermal expansion • Superior dimensional stability • Passes fungus resistance MIL-STD-810G • Withstands 1,000 hours 85°C/85% RH Master Bond EP30LTE-LO ...

... temperature resistant • Thermally conductive • Tough and flexible • Easy to apply and doesn’t require freezing • Excellent electrical insulation properties • Uniform bond line thickness Master Bond FLM36 is a ...

... prominent use is as a glob top material, it also can be utilized as a die attach, potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA low outgassing test ...

... Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low ...

... Key Features - Available in 30 gram preforms - High temperature resistant - Thermally conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - Meets NASA low ...

... type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant in electronic and related applications, where high temperature resistance, good electrical insulation ...

Working temperature: -80 °F - 400 °F

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. ...

... color. As mentioned above, this multifaceted system can be used as a glob top or die attach and in other applications as an adhesive or sealant in electronics when the special combination of properties, particularly the limited flow characteristics ...

... Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has a 100:60 mix ratio by ...

Working temperature: -70 °C - 180 °C

... temperatures, KB 1613 R80 is widely used in electronics, aerospace, major OEM and similar applications. Product Highlights Thermally conductive Lower exotherm while curing Expeditious cures at 80°C or higher ...

Working temperature: -50 °C - 180 °C

... RLV is widely used in electronics and microelectronics packaging and assembly applications. Product Highlights Thermally conductive Castable up to 1 inch thicknesses Rapid cures at elevated temperatures ...

Working temperature: -70 °C - 200 °C

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve ...

Working temperature: -70 °C - 200 °C

... for die attach applications. Product Highlights Remarkable die shear strength Ultimate dispensing profile Thermally conductive Low ionic content (chlorine < 15 ppm) Capable of passing NASA low outgassing ...

Working temperature: -70 °C - 200 °C

... remarkable performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. Product Highlights Low ionic content Outstanding ...

Working temperature: -70 °C - 180 °C

... it suitable for use in various other electronics, aerospace and distinctive OEM applications. Product Highlights Thermally conductive Low ionic content Extremely fast cure Outstanding dimensional stability ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature. ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher temperatures. TUF ...

Working temperature: -269 °C - 200 °C

... Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical as well as ...

... formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive ...