Silicone adhesive Dissipator® 746

for thermoplasticssingle-componentviscosity

Product Description Hernon® Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical Applications Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks. Typical Properties (Uncured) Property Value Chemical type Modified acrylic Appearance White paste Viscosity at 77ºF (25ºC), cP at 2.5 rpm 500,000 to 1,000,000 at 5 rpm 300,000 to 800,000 Specific gravity 1.64 Flash point See SDS Typical Properties (Cured) Physical Properties Property Value Coefficient of thermal expansion, ASTM D696 (K-1) 50 x 10-6 Coefficient of thermal conductivity, ASTM C 177, W/(m·K) 0.92 Temperature Range, ºC (ºF) -55 to 150 (-65 to 300) Impedence Measurements Specimens cured at 10:1 weight ratio with activator 15. Mixed quickly for a few minutes and cured under compression for 24 hours at room temperature.