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Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h
... /li>
Master Bond
... levels. The low outgassing properties enable this UV to be used in a wide array of optical, electro-optical and vacuum applications that until now have not been possible for UV curable systems. It should be noted that ...
Master Bond
... EP30LTE-LO is a specialty epoxy system featuring an exceptionally low coefficient of thermal expansion (CTE) that meets NASA low outgassing specifications. It can be used in bonding, coating, sealing ...
Master Bond
... potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and clean room applications. ...
Master Bond
... filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low exotherm * High flexibility and temperature resistance Master Bond MasterSil 151TC is a two component ...
Master Bond
... conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - Meets NASA low outgassing specifications Master Bond EP36AO is a unique one component, high performance ...
Master Bond
... Key Features - Low viscosity - Minimal shrinkage upon curing - Superb optical clarity - Cures at 80°C in shadowed out areas Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. It is formulated to cure readily ...
Master Bond
... from -80°F to +600°F. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant ...
Master Bond
... high tech aerospace, electronics, optical and specialty OEM applications. Key Features • Thixotropic low viscosity • Meets NASA low outgassing specifications • Minimal shrinkage upon curing • Cures ...
Master Bond
... Superior Toughened Epoxy Chemically resistant, toughened epoxy, Master Bond Supreme 62-1, features excellent flow properties and a long working life. With a wide service temperature range of -60°F to 450°F, it resists acids, bases and solvents and offers ...
Master Bond
Working temperature: 180 °C - 200 °C
Polymerization time: 20 s - 40 s
... closing boxes but also for assembly and assembly work. TRANSPARENT UNIVERSAL STICK GLUE Hot melt adhesive stick type A036 Universal transparent Hot melt adhesive ...
Working temperature: -70 °C - 200 °C
... water. TUF 1613 HT-CM although most commonly used for glop topping, its superior performance and the ability to pass NASA low outgassing standards, makes it suitable for use in various electronics, aerospace and vacuum ...
Kohesi Bond
Working temperature: -70 °C - 200 °C
... Remarkable die shear strength Ultimate dispensing profile Thermally conductive Low ionic content (chlorine < 15 ppm) Capable of passing NASA low outgassing Unlimited working life at room ...
Kohesi Bond
Working temperature: -269 °C - 200 °C
... temperatures. TUF 1820 AOHT offers a sweeping serviceable temperature range of 4K and it is capable of passing NASA standards for low outgassing (ASTM E-595). This product can withstand severe thermal cycling and shocks ...
Kohesi Bond
Working temperature: -269 °C - 200 °C
... resistance to a variety of acids, bases, fuels and water. Owing to its dazzling performance, capability of passing NASA low outgassing test and ease of use, TUF 1820 HTS is widely used in demanding electronics, optoelectronic, ...
Kohesi Bond
... formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives ...
Kohesi Bond
Working temperature: -269 °C - 120 °C
... Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most flexible epoxies. This epoxy system readily cures at room temperature ...
Kohesi Bond
Working temperature: -70 °C - 180 °C
... 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test. The optimal cure schedule is an overnight room temperature set-up followed by ...
Kohesi Bond
... is optically clear and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low ...
Kohesi Bond
... thermally conductive and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low ...
Kohesi Bond
Working temperature: -50 °C - 120 °C
... thermal conductivity Very low coefficient of thermal expansion Phenomenal dimensional stability Excellent flow properties Outstanding electrical insulation properties Capable of passing NASA low outgassing Typical ...
Kohesi Bond
... DELO KATIOBOND adhesives are light-curing epoxies that cure via cationic polymerization. They are characterized by their high adhesive strength, low shrinkage and excellent resistance to chemical and ...
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