Electrically insulating adhesives

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two-component adhesive
two-component adhesive
EP31

Key Features - Convenient handling - Excellent structural adhesive - Combines low viscosity and optical clarity - Provides superior electrical insulation values Master Bond EP31 is a two part epoxy system used ...

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Master Bond
single-component adhesive
single-component adhesive
MasterSil 773

Key Features - Ultra low viscosity - Fast tack-free time - Superb protection to high humidity - Resists high temperature, shock and vibration Master Bond MasterSil 773 is an easy to use, solvent-free, one component, exceptionally ...

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Master Bond
two-component adhesive
two-component adhesive
MasterSil 151Med

... Features • Meets USP Class VI specifications • Passes ISO 10993-5 for cytotoxicity • High flexibility • Optically clear • Electrically insulative • Low viscosity Master Bond MasterSil 151Med is a two component, ...

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Master Bond
UV-polymerized adhesive
UV-polymerized adhesive
UV15DC80

Key Features • Allows for curing in “shadowed out” areas • Cures at temperatures as low as 80°C • Convenient no mix system • Excellent physical strength properties Master Bond UV15DC80 is a special dual cure epoxy based system ...

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Master Bond
UV-polymerized adhesive
UV-polymerized adhesive
UV18S

Key Features • Outstanding chemical resistance • Excellent light transmission • No air inhibition while curing • High bond strength Master Bond UV18S is a special UV system for bonding, coating and sealing featuring superb chemical ...

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Master Bond
two-component adhesive
two-component adhesive
EP30LTE-LO

... 18 x 10-6 in/in/°C; markedly lower than other systems. Additionally, it has very good thermal conductivity and is highly electrically insulative. EP30LTE-LO is also noteworthy for its superior dimensional stability. Its ...

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Master Bond
epoxy adhesive
epoxy adhesive
FLM36

... • Excellent electrical insulation properties • Uniform bond line thickness Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class ...

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Master Bond
single-component adhesive
single-component adhesive
Supreme 3HTND-2CCM

Key Features - Convenient handling and fast curing - Ideal for glob topping - Stellar electrical insulation properties - Withstands 1,000 hours 85°C/85% RH Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, ...

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Master Bond
silicone adhesive
silicone adhesive
MasterSil 151TC

Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low exotherm * High ...

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Master Bond
silicone adhesive
silicone adhesive
Mastersil 155

... faster at elevated temperatures to a tough, flexible and electrically conductive silicone rubber. With a service temperature range of -85°F to +400°F, this two component black colored electrically conductive ...

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Master Bond
epoxy adhesive
epoxy adhesive
KB 1427 HT

Working temperature: 220 °C - 230 °C

Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150°C for curing, it can achieve faster cures at elevated temperatures. ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
KB 1613 HT

Working temperature: 120 °C

Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
KB 1613 R80

Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
KB 1613 RLV

Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
TUF 1613 HT-CM

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
TUF 1613 HT-DA

Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
TUF 1613 HT-GT

... remarkable performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. Product Highlights Low ionic content ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
TUF 1613 HT-SM

Kohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
TUF 1820 ANHT

Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
TUF 1820 AOHT

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher ...

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Kohesi Bond