Epoxy adhesive EP54TC
for plasticsfor ceramicsfor composite materials

Epoxy adhesive - EP54TC - Master Bond - for plastics / for ceramics / for composite materials
Epoxy adhesive - EP54TC - Master Bond - for plastics / for ceramics / for composite materials
Epoxy adhesive - EP54TC - Master Bond - for plastics / for ceramics / for composite materials - image - 2
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for plastics, glass, for ceramics, for composite materials
Number of components
two-component
Applications
for bonding, sealing, for electronics, for coating, for OEM, for the aerospace industry, for filling applications
Technical characteristics
low outgassing, dimensionally stable, heat-curing, with hardener, electrically insulating, thermally-conductive, high-temperature, water-resistant
Other characteristics
REACH compliance
Working temperature

Max.: 204 °C
(399.2 °F)

Min.: -73 °C
(-99.4 °F)

Polymerization time

Max.: 6 h

Min.: 1 h

Description

Product Summary
EP54TC is a two-part, heat-cured epoxy formulated to provide high thermal conductivity while maintaining electrical insulation and low thermal resistance. It uses small particle fillers (5–30 μm) enabling very thin bond lines for efficient heat transfer.

Key Features
  • Thermal conductivity: 6.0–6.5 W/(m·K)
  • Suitable for very thin bond lines
  • Low thermal resistance
  • Low coefficient of thermal expansion


Typical Properties
  • Viscosity: 100,000–200,000 cps
  • Cure schedule: 80°C for 2 hours followed by 2–4 hours at 90–125°C; alternative 4–6 hours at 80–90°C
  • Hardness: 85–95 Shore D
  • Service temperature range: -100°F to +400°F (-73°C to +204°C)
  • Dielectric constant: 4.7
  • Thermal conductivity: 41.6–45.1 BTU·in/(ft²·hr·°F) [6.0–6.5 W/(m·K)]


Product Description
EP54TC is a thermally conductive, electrically insulating two-part epoxy with a 100:5 mix ratio by weight and an approximate working life of 60–90 minutes. After cure the system exhibits high thermal conductivity, electrical insulation, low shrinkage and dimensional stability. It bonds to metals, composites, glass, ceramics and many plastics and resists water, fuels, oils and many acids and bases. Part A is gray; Part B is amber clear. Thermal resistance is very low (~5–7 x 10^-6 K·m²/W). Typical sectors include aerospace, electronics and specialty OEMs where efficient heat transfer combined with electrical insulation is required.

Product Advantages
  • Combines high thermal conductivity with electrical insulation
  • Paste consistency for controlled application
  • Low coefficient of thermal expansion
  • Low thermal resistance for efficient heat transfer
  • Meets NASA low outgassing requirements


Applications
  • Bonding
  • Sealing
  • Coating
  • Gap filling


Certifications & Compliance
  • Meets EU Directive 2015/863
  • ASTM E595 compliant (low outgassing)
  • Passes NASA low outgassing


Characteristics / Technical Specifications
  • Commercial designation: EP54TC
  • Mix ratio (by weight): 100 : 5
  • Working life: ≈60–90 minutes
  • Cure schedules: 80°C for 2 h + 2–4 h at 90–125°C; or 4–6 h at 80–90°C
  • Viscosity: 100,000–200,000 cps
  • Hardness: 85–95 Shore D
  • Service temperature range: -100°F to +400°F (-73°C to +204°C)
  • Dielectric constant: 4.7
  • Thermal conductivity: ~6.0–6.5 W/(m·K)
  • Thermal resistance: ~5–7 x 10^-6 K·m²/W
  • Filler particle size: 5–30 microns
  • Substrate compatibility: metals, composites, glass, ceramics, many plastics
  • Chemical resistance: resists water, fuels, oils and many acids and bases
  • Color: Part A gray; Part B amber clear

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.