Epoxy resin glue Supreme 10HTLV

for plasticsfor ceramicsglass

Product Summary
Master Bond Supreme 10HTLV is a one-component, toughened epoxy adhesive formulated for elevated-temperature cure and demanding aerospace and electronics applications. It provides high shear and peel strengths, excellent resistance to mechanical and thermal shock, cryogenic serviceability and NASA low outgassing performance. The material is room-temperature storable, requires no pre-mixing, maintains constant viscosity over time and supports versatile cure schedules.

Key Features

• No-mix, single-component system
• Service temperature range: 4K to +400°F (≈ -269°C to +204°C)
• Unlimited working life at room temperature
• High resistance to mechanical and thermal shocks
• NASA low outgassing (ASTM E595) compliant
• Validated durability: 1,000 hours at 85°C/85% RH

Typical Properties
Viscosity: 200,000–400,000 cps
Cure schedule: 60–75 minutes at 250°F (≈121°C); 35–40 minutes at 300°F (≈149°C)
Hardness: 70–80 Shore D
Service temperature: 4K to +400°F (≈ -269°C to +204°C)

Highlighted Material Properties

• Tensile lap shear strength: 3,600–3,800 psi
• Volume resistivity: >10^12 ohm-cm
• T-peel strength: up to ~30 pli (application dependent)

Product Description
Master Bond Supreme 10HTLV combines high shear and peel strengths with user-friendly handling. The one-component formulation requires no mixing and retains a stable viscosity over time, ensuring consistent application and handling. It cures at elevated temperatures according to the listed schedules and is cryogenically serviceable, making it suitable for components exposed to extreme thermal ranges. The cured material adheres well to metals, glass, ceramics and many plastics, and acts as a reliable electrical insulator.

Product Advantages

• High shear and peel strength across similar and dissimilar substrates
• Cryogenic-capable and wide thermal range
• Excellent thermal cycling and vibration resistance
• Unlimited working life at ambient temperature
• Flexible cure schedules to match process constraints
• 100% reactive formulation; no solvents or diluents
• Lower-viscosity variant of standard Supreme 10HT for improved flow control

Applications

• Bonding of structural and electronic components
• Sealing and protective coatings
• Gap filling and assembly potting
• Use in aerospace, electronics, electrical and related industries

Certifications

• ASTM E595 compliant (NASA low outgassing)
• Validated: 1,000 hours at 85°C/85% RH
• Meets EU Directive 2015/863 (RoHS)

Packaging

• Can
• Pail
• Single barrel cartridge
• Syringe

Technical specifications

• System: One-component, toughened epoxy (no-mix)
• Viscosity: 200,000–400,000 cps
• Cure schedule: 60–75 min at 250°F (≈121°C); 35–40 min at 300°F (≈149°C)
• Hardness: 70–80 Shore D
• Service temperature range: 4K to +400°F (≈ -269°C to +204°C)
• Tensile lap shear strength: 3,600–3,800 psi
• T-peel strength: up to ~30 pli (application dependent)
• Volume resistivity: >10^12 ohm-cm
• Chemical resistance: water, oils, fuels, solvents, acids and bases
• Outgassing: NASA low outgassing / ASTM E595 compliant
• Durability: Withstands 1,000 hours at 85°C/85% RH; resistant to thermal/mechanical shock and vibration
• Storage/handling: Unlimited working life at room temperature; storable at ambient; viscosity remains constant with time
• Composition: 100% reactive; contains no solvents or diluents