Sealing adhesives

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epoxy adhesive
epoxy adhesive
EP3HTS-TC

Working temperature: -80 °F - 400 °F

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at ...

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Master Bond
epoxy adhesive
epoxy adhesive
EP30-4Med

Working temperature: -50 °F - 250 °F

... meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. It can be used for bonding, sealing, and small encapsulation applications. It can also be utilized as a coating, especially ...

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Master Bond
epoxy adhesive
epoxy adhesive
EP4G-80Med

... component, low viscosity, graphite filled epoxy. This material has exceptional flow properties and can be used for bonding, sealing and coating applications. It combines good thermal and electrical conductivity. It withstands ...

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Master Bond
silicone adhesive
silicone adhesive
CHO-BOND® 1030

Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO-BOND® 1030 is a light grey-colors ...

dual-curing adhesive
dual-curing adhesive
DELO DUALBOND

... reliable curing in shadowed areas Universal adhesion to many substrates Optimum flow behavior for sealing and casting Transparent dual cure adhesives available for large bonding areas

epoxy adhesive
epoxy adhesive
KB 1427 HT

Working temperature: 220 °C - 230 °C

Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150°C for curing, it can achieve faster cures at ...

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Kohesi Bond
epoxy adhesive
epoxy adhesive
KB 1427 HT-3

... Glass transition temperature (Tg) of 120°C Unlimited working life at room temperature Typical Applications Bonding Sealing Potting Encapsulation

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Kohesi Bond
epoxy adhesive
epoxy adhesive
KB 1613 R80

Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working ...

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Kohesi Bond
single-component adhesive
single-component adhesive
Repair Stick

The all-round product for quick, elastic and non-shrink repairs and touch-ups on nearly all surfaces. Repair Stick Multi fills and seals cracks, holes, damages and leaks. It can be used on metal, wood, stone, ceramics, plastic and ...

epoxy adhesive
epoxy adhesive

Permabond single-part epoxy adhesives are suitable for bonding a wide variety of materials. They are available with a range of different viscosities and with and without metal filler. Permabond epoxies have been developed ...

polyurethane adhesive
polyurethane adhesive
PU 50

... scentless. The paste hardens in consequence of the high temperature emmited form exhaust system of the vehicle. Use: For sealing crack points, holes and perforations of exhaust system. Appliction: The surface must be ...

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APP sp. z o.o.
acrylate adhesive
acrylate adhesive
AST-GASKET MAKER™

AST-GASKET MAKER™ is a smooth, thick, purple paste. The anaerobic chemistry of this product creates a tough flexible formed-in-place gasket. Once confined between two components, AST-GASKET MAKER provides an instant low pressure seal. Features ...

polyurethane adhesive
polyurethane adhesive
FIL STIK Series

... be cut less than 1 hour from application. Applications: Fill Stik Mega in suitable both for filling and fire resistant sealing application. Fill Stick Mega is used for thermal and acoustic insulation, for filling pipes ...

epoxy adhesive
epoxy adhesive
Structalit®

... resin adhesives of the Structalit® series are the perfect choice for bonding dissimilar substrates. Each adhesive features different properties, offering a perfect bonding solution for every substrate ...