Epoxy adhesive EP6STC-80

for plasticsfor ceramicsfor composite materials

Product summary
Master Bond EP6STC-80 is a one-component, silver-filled epoxy with a smooth paste consistency. It is highly thermally conductive and electrically conductive, formulated for bonding, sealing and coating applications. The product has no solvents or diluents, exhibits low shrinkage on curing and is a high modulus, high compressive strength system. It is supplied in syringes and jars; after use the syringe or jar should be returned to refrigerated storage.

Key Features

• Paste consistency
• Available in syringes and jars
• Unlimited working life at room temperature; requires heat cure
• Exceptionally high thermal and electrical conductivity

Typical properties

• Viscosity: Thixotropic
• Hardness: 85-95 Shore D
• Service temperature range: -60°C to +150°C
• Thermal Conductivity: 13-14 W/(m·K)
• Volume Resistivity: <0.001 ohm-cm

Cure / handling
EP6STC-80 has an unlimited working life at ambient temperatures and cures when heated to 80-90°C (typical cure schedule: 3-5 hours at the cure temperature). Maximum filler particle size is about 20 microns. The high filler loading yields an exceptionally low thermal resistance on cure (approximately (1-5) x 10^-6 K·m^2/W).

Substrates and resistance
Forms strong bonds to metals, ceramics, composites and many plastics. Good resistance to water, oils and fuels. Not suitable where electrical insulation is required (electrically conductive).

Applications

• Opto-electronics
• Acoustical systems
• Automotive
• PCB assembly and other applications requiring high thermal conductivity

Certifications / compliance
ASTM E595 compliant; meets EU Directive 2015/863 (RoHS restrictions).

caractéristiques / spécifications techniques

• Model: EP6STC-80
• Form: One-component, silver-filled epoxy paste
• Viscosity: Thixotropic
• Hardness: 85-95 Shore D
• Thermal conductivity: 13-14 W/(m·K)
• Volume resistivity: <0.001 ohm-cm
• Service temperature: -60°C to +150°C
• Cure: Heat cure at 80-90°C (typical 3-5 hours)
• Working life: Unlimited at room temperature (requires heat to cure)
• Maximum particle size: ~20 microns
• Shrinkage: Low on curing
• Typical packaging: Syringes and jars
• Notable properties: High modulus, high compressive strength, low thermal resistance ((1-5) x 10^-6 K·m^2/W)