Epoxy resin Supreme 121AOND
for electronic applicationsencapsulationsealing

Epoxy resin - Supreme 121AOND - Master Bond - for electronic applications / encapsulation / sealing
Epoxy resin - Supreme 121AOND - Master Bond - for electronic applications / encapsulation / sealing
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Characteristics

Type
epoxy
Applications
for electronic applications, encapsulation, sealing, for bonding, for aeronautical applications
Other characteristics
high-temperature, for OEM, thermally conductive

Description

Supreme 121AOND is a thermally conductive epoxy for bonding, sealing and encapsulation. The system combines a high glass transition temperature along with an element of toughness, making it less rigid than typical higher temperature resistant epoxies. Key features include: Paste consistency High temperature resistance Exceptionally long open time Passes NASA low outgassing Supreme 121AOND bonds to a wide variety of substrates including metals, composites, glass, and many rubbers and plastics. It adheres especially well to glass, fibers and ceramics. It should be considered in demanding aerospace, electronic, opto-electronic and specialty OEM type applications where this product profile is needed.

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