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... is a heat cured epoxy system used for bonding, sealing, coating and encapsulating applications. This tool features complete reactiveness and it does not contain solvents or diluents. It is equipped with a specialized formulated epoxy ...
... The EP30FL model in the Master Bond Polymer System has a two-component epoxy resin design for casting, bonding, sealing, potting and encapsulation. It features low viscosity and high performance with no volatiles or solvents ...
... ARATHERM™ epoxy casting systems are recommended for the manufacturing of motor stators, generators, actuators, modules, sensors, and devices which require high thermal conductivity. These resin systems ...
... The epoxy resin system WEICON F2 is suitable for the casting of models, moulds and templates, for the repair of porous and damaged castings, for the production of prototypes and holding devices, and for ...
WEICON
EPOXONIC® 33 is especially suited for low stress potting of temperature sensitive electronic devices with high demands on mechanical properties (e.g. PCB).
EPOXONIC GmbH Reaktionsharzsysteme
... Electronic component, Electronic component resin, Epoxy resin, Industrial transformer, Motor resin, motors, products, Small transformer, Transformer resin ...
... shrinkage Good casting ability Post annealing not required Finest impression accuracy Casting without air pockets High heat resistance Problem-free pouring of small and large quantities (1 kg - 2500 kg) The ...
ALWA Technische Produkte für Kunststoffverarbeitung
... components free. For castings in glass recipients, a flexible version is possible when using a 100/90 mixing ratio. Please contact our technical department for further information about flexible version. Bio based clear casting ...
Resoltech
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