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Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h
... amber clear. Thermal resistance is very low (~5–7 x 10^-6 K·m²/W). Typical sectors include aerospace, electronics and specialty
OEMs where efficient heat transfer combined with electrical insulation is required.
Product Advantages
Master Bond
... Key Features - Convenient handling - Excellent structural adhesive - Combines low viscosity and optical clarity - Provides superior electrical insulation values Master Bond EP31 is a two part epoxy system used primarily for bonding, ...
Master Bond
... Key Features • One component, easy to apply • Can be used as a primer or adhesive • Cures tough, not rigid • Cures at ambient or elevated temperatures Master Bond X21 is a specially formulated one component system for bonding and ...
Master Bond
... • Excellent electrical insulation properties • Uniform bond line thickness Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity ...
Master Bond
... Key Features • Outstanding abrasion resistance • Superior non-yellowing properties • Excellent flexibility and toughness • Moderate viscosity Master Bond UV15X-6NM-2 is a one component, UV curing urethane acrylate system featuring vibrant flexibility, ...
Master Bond
... . Its whole product series provides a broad spectrum of adhesives including silicones, both LED and UV cure system, polyurethanes, epoxies as well as cyanoacrylates. The whole adhesive system is capable of curing ...
Master Bond
... dual cure system with high dimensional stability. It may be used for high tech aerospace, electronics, optical and specialty OEM applications. Key Features • Thixotropic low viscosity • Meets NASA low outgassing specifications • ...
Master Bond
... Superior Toughened Epoxy Chemically resistant, toughened epoxy, Master Bond Supreme 62-1, features excellent flow properties and a long working life. With a wide service temperature range of -60°F to 450°F, it resists acids, bases and solvents and offers ...
Master Bond
... optically opaque. This versatile system is a viable candidate for applications in the aerospace, electronic, optical and specialty OEM industries, where this very special set of product properties is desirable. Product Advantages • ...
Master Bond
Working temperature: -60 °F - 350 °F
... One component, nanosilica filled, dual cure system with UV and heat curing mechanisms Key Features - Thixotropic paste - Minimal shrinkage upon curing - Low coefficient of expansion - Cures in shadowed out areas at 80°C Master Bond UV22DC80ND ...
Master Bond
Working temperature: 5 °C - 40 °C
Packaging: 300 ml
... recommended to apply the adhesive with a piston-type application gun. SikaTack® GO! can be applied with quality manual application guns. Consider that the viscosity will increase at low temperature. For easy application, condition the ...
SIKA INDUSTRY
Working temperature: -10 °C - 35 °C
... Cured to Automotive OEM Level within 60 minutes almost independent of climate PRODUCT BENEFITS 30 min Minimum Drive Away Time, acc. FMVSS 212 / 95th percentile dummies Enables fast, robust ADAS calibration Cured to Automotive ...
SIKA INDUSTRY
Working temperature: -10 °C - 35 °C
Packaging: 600 ml
... increase at low temperature. For easy application, condition the adhesive at ambient temperature prior to use. To ensure a uniform thickness of the bondline it is recommend to apply the adhesive in form of a triangular ...
SIKA INDUSTRY
Working temperature: 10 °C - 35 °C
Packaging: 600 ml
... Sikaflex®-296 is a high performance elastic gap-filling 1-C polyurethane direct glazing adhesive that cures on exposure to atmospheric moisture. It is suitable for almost all kind of minearal glazing application in the ship building industry. Sikaflex ...
SIKA INDUSTRY
... Sensor-safe, non-corrosive formula • Resist to powertrain fluids • Eliminates the need for pre-formed, pre-cut gaskets • OEM specified and approved for dealership warranty requirements Suggested Applications • Oil pans, timing ...
PERMATEX
... Sensor-safe, non-corrosive formula • Resist to powertrain fluids • Eliminates the need for pre-formed, pre-cut gaskets • OEM specified and approved for dealership warranty requirements Suggested Applications • Oil pans, timing ...
PERMATEX
Permatex Anaerobic Gasket Maker is a noncorrosive gasketing material designed primarily for use on aluminum, iron, and steel flanged mating surfaces. Ideal for on-the-spot and emergency repairs, or when a conventional gasket is unavailable. Fills gaps ...
PERMATEX
Working temperature: 149 °C
... Anaerobic Flange Sealant is a flexible gasketing material for use on rigid machined flanges with less than .015″ gap. This OEM approved Anaerobic Flange Sealant can be used where OE’s specify “anaerobic gasket (cures in the absence of ...
PERMATEX
... Permatex’s Bearing Mount Relaxed Fit Adhesive is an OEM specified, high strength, medium viscosity anaerobic adhesive for slip fit assemblies. This Relaxed Fit Adhesive provides 2,800 ...
PERMATEX
... Windglass Glue is a one component, thixotropic, moisture curing polyurethane adhesive, primarily used for automotive direct glazing with and without airbag. It cures in a longer time allowing application on big windscreens ...
Working temperature: -60 °C - 340 °C
... performance and ease of use, KB 1427 HT is ideal for use in aerospace, oil and chemical processing, electronics and various OEM applications. PRODUCT HIGHLIGHTS - Admirable chemical resistance - Excellent flow properties - Low ...
Kohesi Bond
Working temperature: -50 °C - 200 °C
... splendid performance and ease of use, KB 1427 HT-3 is ideal for use in aerospace, electronics, chemical processing and various OEM applications. Product Highlights Superb electrical insulation Snap curing Impressive chemical ...
Kohesi Bond
Working temperature: -50 °C - 200 °C
Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster ...
Kohesi Bond
Working temperature: -70 °C - 180 °C
... performance, ease of use and speedy cures at convenient temperatures, KB 1613 R80 is widely used in electronics, aerospace, major OEM and similar applications. Product Highlights Thermally conductive Lower exotherm while curing ...
Kohesi Bond
Working temperature: -70 °C - 180 °C
... applications, its superior performance also makes it suitable for use in various other electronics, aerospace and distinctive OEM applications. Product Highlights Thermally conductive Low ionic content Extremely fast cure ...
Kohesi Bond
Working temperature: -269 °C - 200 °C
... performance and ease of use, TUF 1820 ANHT is widely used in sophisticated electronics, optoelectronic, aerospace and specialty OEM applications. Product Highlights Sensational thermal conductivity Cryogenically serviceable ...
Kohesi Bond
Working temperature: -269 °C - 200 °C
... performance and ease of use, TUF 1820 AOHT is widely used in various other electronics, optoelectronic, aerospace and specialty OEM applications. Product Highlights Capable of passing NASA standards for low outgassing (ASTM E-595) ...
Kohesi Bond
Working temperature: -269 °C - 200 °C
... outgassing test and ease of use, TUF 1820 HTS is widely used in demanding electronics, optoelectronic, aerospace, specialty OEM and various vacuum based applications. Product Highlights Silver filled electrically conductive ...
Kohesi Bond
... formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives ...
Kohesi Bond
Working temperature: -50 °C - 120 °C
... cure at 70°C – 90°C for 3 – 5 hours. KB 1031 SPLV-6 offers an extensive serviceable temperature range. It is an outstanding adhesive that offers superb physical strength properties and bonds well to similar and dissimilar substrates with ...
Kohesi Bond
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