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Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h
... consistency for controlled application
Applications
- Bonding <
... two component silicone for use primarily in thermal management applications. It is primarily used for bonding or smaller gap filling. It has very fine particles of a thermally conductive filler that allows ...
Working temperature: -60 °C - 175 °C
... a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional ...
Working temperature: -62 °C - 100 °C
Packaging: 85, 454 ml
... makes it effective for overhead and vertical surface applications • No volatile organic compounds • 1:1 mix ratio makes measurement and application very easy Typical Applications: • Gap filling ...
Working temperature: 5 °C - 35 °C
... Epoxy adhesive NOWAX is used for the chemical welding, filling, hermetic sealing and agglutination of most metals (aluminium, brass, copper, iron, tin, stainless steel, steel et al), concrete, wood, ceramics, hard plastic ...
Working temperature: -55 °C - 150 °C
Shear strength: 18 N
... efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. High thixotropy, suitable for filling and bonding of large ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 60, 80 °C
Polymerization time: 60, 20 min
... glass transition temperature and modulus for the intended application. Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable for ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 80 °C
Polymerization time: 5 min - 10 min
... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 80 °C
Polymerization time: 5 min - 10 min
... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 80 °C
Polymerization time: 2 min
... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 120, 100 °C
Polymerization time: 10, 5 min
... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 100, 120, 150 °C
Polymerization time: 10, 15, 30 min
... glass transition temperature and modulus for the intended application. One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 150, 165 °C
Polymerization time: 3, 5 min
... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 130, 150 °C
Polymerization time: 8, 5 min
... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 130 °C
Polymerization time: 8 min
... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...
Shenzhen DeepMaterial Technologies Co., Ltd
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