Adhesives for filling applications

... two component silicone for use primarily in thermal management applications. It is primarily used for bonding or smaller gap filling. It has very fine particles of a thermally conductive filler ...

Working temperature: -60 °C - 175 °C

... a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing ...

Working temperature: -55 °C - 150 °C
Shear strength: 18 N

... efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. High thixotropy, suitable for filling and ...

Working temperature: 60, 80 °C
Polymerization time: 60, 20 min

... glass transition temperature and modulus for the intended application. Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product ...

Working temperature: 80 °C
Polymerization time: 5 min - 10 min

... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...

Working temperature: 80 °C
Polymerization time: 5 min - 10 min

... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...

Working temperature: 80 °C
Polymerization time: 2 min

... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...

Working temperature: 120, 100 °C
Polymerization time: 10, 5 min

... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...

Working temperature: 100, 120, 150 °C
Polymerization time: 10, 15, 30 min

... glass transition temperature and modulus for the intended application. One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly ...

Working temperature: 150, 165 °C
Polymerization time: 3, 5 min

... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...

Working temperature: 130, 150 °C
Polymerization time: 8, 5 min

... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...

Working temperature: 130 °C
Polymerization time: 8 min

... flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler ...