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Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low exotherm * High ...
Two component thermally conductive flame retardant epoxy system that complies with FAR standard 14 CFR 25.853(a) for flame retardancy Key Features - Tested as per Amendment 25-116 and Part 25 Appendix F - Passes vertical burn test - ...
Working temperature: -55 °C - 150 °C
Shear strength: 19 N
... curing adhesive product line covers the main applications of structural bonding. In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable ...
Shenzhen DeepMaterial Technologies Co., Ltd
... curing adhesive product line covers the main applications of structural bonding. In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable ...
Shenzhen DeepMaterial Technologies Co., Ltd
... realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. The no-flow package is designed for local circuit board ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: -18 °C - 370 °C
Kohesi Bond KB-SS-G is a graphite filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers high levels of shielding towards electromagnetic interference (EMI) and ...
Working temperature: -30 °C - 370 °C
Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This products offers the highest level of shielding towards electromagnetic interference ...
Characteristics of Polyamide Hot Melt Glue Stick : 1. High bonding strength and wide bonding materials 2. Halogen-free Hot Melt Adhesive that is in Compliance with UL94V0 flame retardant 3. High Temperature Resistant 4. ...
UL Hot Melt Adhesive Sticks Characteristics:1.UL Hot Melt Adhesive that is in Compliance with UL94V0 flame retardant(UL Certificate number: E209485)2.Excellent Adhesion Performance : suitable for fixing ...
... conformal coatings and encapsulants for printed circuit boards (PCB) and electronics assembly applications are specifically formulated to ensure complete cure in applications ...
Packaging: 500, 85 ml
... Great adhesion strength (1500 PSI lap shear) Typical Applications: • Sealant for microwave modules and components • Circuit board repair • Grounding applications • EMI shielding applications
Product Description Hernon® Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. ...
Hernon Manufacturing
Printing adhesive JU-50P Multi-purpose printing adhesive with consistent workability Stable printability and print shape JU-50P achieves a consistent stencil release property regardless of the ...
Koki Company Limited
... or LED systems. The Vitralit® adhesives are the perfect choice for high volume production. The short exposure times allow processing and bonding of temperature sensitive substrates. By thermally post-curing the adhesives, ...
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