Epoxy adhesive CHO-BOND® 592

for metaltwo-componentconductive

Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting dissimilar materials both electrically and thermally. Features and Benefits: • Long pot life (4-6 hours at 25°C) allows for application flexibility • Room temperature curing available • Excellent thermal properties (low thermal impedance and good thermal shock resistance) • Can be thinned for spray applications • Good electrical conductivity (0.05 ohm-cm) • Great adhesion strength (1500 PSI lap shear) Typical Applications: • Sealant for microwave modules and components • Circuit board repair • Grounding applications • EMI shielding applications