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Silicone adhesive CHO-BOND® 1030
for metalsingle-componentfor bonding

Silicone adhesive - CHO-BOND® 1030 - Parker Chomerics Division - for metal / single-component / for bonding
Silicone adhesive - CHO-BOND® 1030 - Parker Chomerics Division - for metal / single-component / for bonding
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Characteristics

Chemical composition
silicone
Type of substrate
for metal
Number of components
single-component
Applications
for bonding, sealing, for electrical appliances
Technical characteristics
electrically-conductive, shear strength
Working temperature

Min.: -55 °C
(-67 °F)

Max.: 200 °C
(392 °F)

Packaging

113 ml, 454 ml
(4 US fl oz, 15 US fl oz)

Description

Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO-BOND® 1030 is a light grey-colors silicone paste that is predominantly used for bonding elastomer gaskets. Features and Benefits: • Silver-plated copper filler is a low cost solution to electrical bonding • Good conductivity levels (0.050 ohm-cm) • Moderate adhesion properties (>200 PSI lap shear strength) • Medium paste consistency means it can be used on overhead or vertical surfaces • No volatile organic compounds and no corrosive by-products generated when curing Typical Applications: • Sealing of EMI vents and windows • Bonding, repair, and attachment of EMI gaskets

Catalogs

Other Parker Chomerics Division products

Electrically Conductive Adhesives, Epoxy & Glue

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.