Epoxy adhesive CHO-BOND® 584-29

for metaltwo-componentfor bonding

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed to be used in very tight applications and around electrical components. Features and Benefits: • Silver filler is a premium conductivity solution to electrical bonding • Excellent conductivity levels (0.002 ohm-com) • Strong adhesion properties (>1200 PSI lap shear strength) • Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids • Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options • Low volatile organic compounds • Comes in standard sizes of pre-measured syringes so no mixing and measuring is required Typical Applications • Electrical component grounding • Cold soldering