Epoxy adhesive ET5428 series
for ceramicsfor composite materialsfor metal

Epoxy adhesive - ET5428 series - Permabond - for ceramics / for composite materials / for metal
Epoxy adhesive - ET5428 series - Permabond - for ceramics / for composite materials / for metal
Add to favorites
Compare this product

Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for ceramics, for composite materials
Number of components
single-component
Applications
industrial, for bonding, automotive, for filling applications
Technical characteristics
impact-resistant, vibration-resistant
Gap fill

5 mm
(0.2 in)

Working temperature

Max.: 60 °C
(140 °F)

Min.: 50 °C
(122 °F)

Description

Toughened structural epoxy
Excellent impact & vibration resistance
Great for structural bonding, especially for composites
Good gap-filling
Colour - Charcoal Black
IDEAL FOR: Carbon fibre, composites structural automotive parts

PERMABOND® ET5428 is a thixotropic two-part adhesive with excellent resistance to impact and vibration. The controlled flow properties as well as its ease of mixing and application, enables the adhesive to be used where gap filling is required. Permabond® ET5428 has been found to provide exceptional performance even at elevated temperatures.
Permabond® ET5428 has been specifically formulated for use in applications requiring toughness and high strength and shows special benefits in the construction of composite assemblies.


Exhibitions

Meet this supplier at the following exhibition(s):

Advanced Engineering
Advanced Engineering

4-05 Nov 2026 Birmingham (United Kingdom) Stand S120

  • More information
    Southern Manufacturing 2027
    Southern Manufacturing 2027

    2-04 Feb 2027 Farnborough (United Kingdom) Stand A165

  • More information
    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.