Epoxy adhesive ET500 series
for ceramicsfor woodfor composite materials

Epoxy adhesive - ET500 series - Permabond - for ceramics / for wood / for composite materials
Epoxy adhesive - ET500 series - Permabond - for ceramics / for wood / for composite materials
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for ceramics, for wood, for composite materials
Number of components
single-component
Applications
industrial, for electronics
Technical characteristics
fast curing
Gap fill

2 mm
(0.08 in)

Working temperature

Max.: 50 °C
(122 °F)

Min.: 40 °C
(104 °F)

Description

Rapid cure and strength development
Bonds many substrates
Clear finish
Easy syringe application
IDEAL FOR: Electronics, ID plates, outdoor signage

PERMABOND® ET500 is a two-part fast-setting epoxy adhesive which bonds to a wide variety of substrates such as wood, metal, ceramics and some plastics and composites. It cures rapidly at room temperature to give handling strength in approximately 5 minutes. This
product is ideal for general purpose bonding. It is typically used for small component assembly and is suitable for applications that require a clear bond line.


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Exhibitions

Meet this supplier at the following exhibition(s):

Advanced Engineering
Advanced Engineering

4-05 Nov 2026 Birmingham (United Kingdom) Stand S120

  • More information
    Southern Manufacturing 2027
    Southern Manufacturing 2027

    2-04 Feb 2027 Farnborough (United Kingdom) Stand A165

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.