Epoxy resin / encapsulation / low-viscosity
ER2183 is a flame retardant, thermally conductive, two part potting and encapsulating compound. The flame retardant technology used is of a 'clean' type leading to relatively low toxicity fumes and low smoke emission.
Low viscosity alternative to ER2220: 5000mPa s
High thermal conductivity; 1.10W/m.K
Easy to mix, uses non-abrasive fillers
Used for encapsulating PCBs or devices requiring effective thermal dissipation