Protective resin Durimide® 20 series

Fujifilm has several non-photosensitive polyimide formulations for a wide variety of semiconductor and related applications. • Final coating thicknesses from 400 Angstroms to 25 microns • Low temperature cure options • Very low shrinkage • Patternable using laser direct or etch methods • NMP free Product Summary • Durimide® 20 Series: Fully imidized polyimide used primarily as a thin lift-off layer. Durimide 20 is stable at room temperature. Final thicknesses from 400 Angstroms to 3 microns possible • LTG 12-52: Low temperature glue designed for die and component attach applications.Final thicknesses from 5 to 25 microns.