Resin for electronic applications LTC 9300

for semiconductorsphotosensitiveUV-curing

Overview
Fujifilm solvent-developable photosensitive polyimides are photo-imageable polyimide precursors and preimidized formulations engineered for redistribution layer (RDL) and buffer coat applications. They support thick-film processing, offer fast photospeed and deliver mechanical properties suited to high-reliability packaging.

Product lineup

• LTC 9300 Series: Low-temperature cure, photo-imageable polyimide precursors sensitive to g- and i-line (also compatible with BB exposure tools), optimized for RDL in advanced packages.
• Durimide17 8300 Series: High-temperature cure, photo-imageable polyimide precursors sensitive to g- and i-line (also compatible with BB exposure tools), intended for buffer coat in high-reliability packages.

Features & benefits

• Negative-tone, solvent-developable polyimide chemistries
• Imageable with g-line, i-line and BB exposure systems
• Low- and high-temperature cure options
• Fast photospeed for high throughput
• Excellent mechanical properties for reliability
• NMP-free formulations available
• Designed for thick-film capability and robust processing

Available datasheets (examples)

• LTC 9300-E07
• LTC 9300-E19
• LTC 9300-E76B
• Durimide17 7020
• Durimide17 7320
• Durimide17 7500
• Durimide17 8500

Technical specifications

• Family: Solvent-developable, photo-imageable polyimide precursors and preimidized formulations
• Imageability: Sensitive to g-line and i-line; compatible with BB exposure tools
• Tone: Negative
• Cure options: Low-temperature (LTC 9300 Series) and high-temperature (Durimide17 8300 Series)
• Typical film thickness: Thick-film capability (approx. 5265 25 bcm)
• Applications: Redistribution layer (RDL) and buffer coat for advanced and high-reliability packaging
• Processing: Engineered for thick-film processing and robust manufacturing
• Safety/chemistry: NMP-free options available