OverviewSolvent-based strippers for positive and negative tone photoresist removal. FUJIFILM’s family of photoresist strippers provide processing choices and performance advantages over current industry standards for both Aluminum & Copper technology. These materials are used for wet removal of bulk and thick plating photoresist in single wafer and batch processes.
Product Lineup- Positive and negative Photoresist Removal and Post etch residue remover.
- DMSO based
- Microstrip™ 3001: broadly applicable bulk photoresist stripper
- Microstrip™ 3200: mild acidic, amine-free stripper with excellent metal compatibility
- Microstrip™ 6800: single wafer tool applicable photoresist stripper with improved cleaning performance on heavily cross-linked photoresist
- Microstrip™ 6310: Heavy duty Cu compatible photoresist stripper
- Microstrip™ 6365: Heavy duty photoresist stripper widely compatible with various metals, including Al and Cu
- Strippers for Negative Photoresist Removal
- Stripper for Positive and Negative Photoresist Removal
Features & Benefits- Designed for optimal performance with formulations that reduce environmental and health impact where possible.
- Packaging options:
- 4 x 4L bottles
- 1 x 20L jerricans
- 200L drums (one way and returnable)
- 1000L IBCs
Technical specifications- Product type: Solvent-based photoresist strippers for positive and negative tone resists
- Applications: Wet removal of bulk and thick plating photoresist; single wafer and batch processes
- Metal compatibility: Designed for Aluminum & Copper technologies (Cu and Al compatible variants available)
- Chemistry highlights: DMSO based formulations and variants with mild acidic, amine-free chemistries
- Available product models: Microstrip™ 3001, Microstrip™ 3200, Microstrip™ 6800, Microstrip™ 6310, Microstrip™ 6365, Microstrip™ V, Gensolve 470
- Packaging: 4 x 4L bottles, 1 x 20L jerricans, 200L drums (one way and returnable), 1000L IBCs
- Designed benefits: Improved cleaning performance on heavily cross-linked photoresist (select grades), optimized for process compatibility with Al and Cu