Semiconductor resin

for electronic applicationsphotosensitive

Overview
Fujifilm negative-tone, polyisoprene-based photoresist series formulated for projection, proximity and contact imaging and compatible wet-etch processes on a variety of substrates. Multiple series cover a wide range of coating thicknesses to meet different resolution and thickness requirements.

Product lineup

• SC Resist series
  For thicker applications with coating thicknesses from 1.8 to 10 µm; optimized for contact exposure.
• IC Type 3 Resist series
  For mid-range thickness applications with coatings from 0.75 to 2.0 µm; suitable for projection, proximity and contact exposure.
• HNR Resist series
  For high-resolution applications with coating thicknesses from 0.50 to 1.40 µm; optimized for proximity and contact exposure.
• HR Resist series
  For applications on highly reflective substrates with coating thicknesses from 0.70 to 1.50 µm; suitable for projection, proximity and contact exposure.

Applications

• Projection, proximity and contact imaging for circuit patterning and microfabrication
• Wet-etch process compatibility across varied substrates, including highly reflective surfaces
• Selection of series enables matching of coating thickness and resolution to specific process requirements

Technical specifications

• Brand: Fujifilm
• Product type: Negative photoresist (polyisoprene-based)
• Tone: Negative
• Polymer base: Polyisoprene-based
• Imaging: Projection, proximity and contact
• Recommended applications: Wet etch processes; applications on highly reflective substrates (HR series)
• SC Resist series: coating thickness 1.8–10 µm — optimized for contact printers
• IC Type 3 Resist series: coating thickness 0.75–2.0 µm — for projection, proximity and contact printers
• HNR Resist series: coating thickness 0.50–1.40 µm — for high-resolution proximity and contact imaging
• HR Resist series: coating thickness 0.70–1.50 µm — for highly reflective substrates with projection, proximity and contact printers