Encapsulation resin Resist series

photosensitive

Multiple series of negative tone, polyisoprene-based resist systems applicable to a broad range projection, proximity and contact imaging and wet etch needs on varied substrates Product Summary • SC Resist series Designed for thicker applications employing from 1.8 to 10 µm coatings for exposure on contact printers • IC Type 3 Resist series Designed for applications employing from 0.75 to 2.0 µm coatings for exposure on projection, proximity and contact printers • HNR Resist series Designed for high resolution applications employing from 0.50 to 1.40 µm coatings for exposure on proximity and contact printers • HR Resist series Designed for applications employing from 0.70 to 1.50 um coatings for exposure on highly reflective substrates on projection, proximity and contact printers