Encapsulation resin Resist series

photosensitive

Multiple series of negative tone, polyisoprene-based resist systems applicable to a broad range projection, proximity and contact imaging and wet etch needs on varied substrates Product Lineup SC Resist series Designed for thicker applications employing from 1.8 to 10 µm coatings for exposure on contact printers IC Type 3 Resist series Designed for applications employing from 0.75 to 2.0 µm coatings for exposure on projection, proximity and contact printers HNR Resist series Designed for high resolution applications employing from 0.50 to 1.40 µm coatings for exposure on proximity and contact printers HR Resist series Designed for applications employing from 0.70 to 1.50 um coatings for exposure on highly reflective substrates on projection, proximity and contact printers