Electrical insulating material Durimide™

polyimidefor insulating systemsself-adhesive

Overview
Fujifilm offers non-photosensitive polyimide formulations engineered for low shrinkage, low-temperature cure and lift-off processes in semiconductor and related applications.

Product lineup

• Durimide™ 32A
  • Fully imidized polyimide for junction coating, passivation and alignment layers. Low shrinkage, low cure temperature; solvent soluble and reworkable.
• Durimide™ 116A
  • Solvent-developable positive-type formulation, yields 4–10 µm cured films for patterning workflows.
• LTG 12-52
  • Low-temperature adhesive designed for die and component attach applications. Final thicknesses typically 5–25 µm.

Features & Benefits

• Final coating thickness range: 1–25 µm
• Low-temperature cure options suitable for temperature-sensitive substrates
• Very low shrinkage to minimize process-induced stress
• Patternable via laser direct imaging or etch methods
• NMP-free formulations available

Downloads

• Non-photosensitive and Permanent glue materials [PDF]

Technical specifications

• Product family: Non-photosensitive polyimides / PBOs (Fujifilm)
• Typical final coating thickness: 1–25 µm (depends on formulation)
• Durimide™ 32A: fully imidized, low shrinkage, low cure temperature, solvent soluble, reworkable
• Durimide™ 116A: solvent-developable positive formulation, cured film thickness 4–10 µm
• LTG 12-52: low-temperature adhesive for die/component attach, final thickness 5–25 µm
• Patterning: compatible with laser direct imaging and etch processes
• Solvent profile: NMP-free options