Protective resin Durimide® 20 series

Fujifilm has several non-photosensitive polyimide formulations for a wide variety of semiconductor and related applications. Features & Benefits • Final coating thicknesses from 400 Angstroms to 25 microns • Low temperature cure options • Very low shrinkage • Patternable using laser direct or etch methods • NMP free Product Lineup Durimide™ 32A Fully imidized polyimide used primarily as junction coating, passivation and aligment layer. Low shrinkage and cure temperature, reworkable and solvent soluble Durimide™ 116A Positive photoresist, solvent developable, 4-10 µm cured films LTG 12-52 Low temperature glue designed for die and component attach applications. Final thicknesses from 5 to 25 microns