Low temperature co-fired ceramic (LTCC) substrate for electronics industry
KOA
Features
• Excellent size accuracy, by KOA's original shrinkage control technology and multi layer technology.
• The high-density wiring by the fine line and pattern is available.
• Miniaturization is possible by burying Inductor, Capacitor, Resistor and Transmission line.
• By the uses of low dielectric-loss ceramics and low loss conductors, the substrates excel in the high frequency characteristic.
• As the thermal expansion coefficient is close to silicon's, the substrates are suitable for the bare chip mounting.
• By preparing the thermal vias under bare chips, the substrates are excellent in the heat dissipation.
• The substrates are outstanding in heat resistance and humidity resistance due to the ceramics used.
• Products meet EU-RoHS requirements .
Applications
• Applications using high frequencies like micro-waves, milli-waves etc.
• Applications used in harsh environment,especially in high temperatures etc.
• Small size mobile communication modules.
• Multi chip modules for bare chips.
• MEMS packages.
• Interposer substrates.
