- Materials - Tools - Components >
- Semi-finished products >
- Substrate for the electronics industry
Substrates for the electronics industry
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
IC substrate is an intermedium that communicates chip and circuit board. Chip and circuit board can be connected by its internal circuit. It is a key component of the IC packaging process which characterized ...
... Grinding and polishing the substrate can improves the parallelism between the top and bottom surfaces. The benefit is that the capacitance and inductance of the substrate can be more tightly controlled ...
... mechanical strength Good heat conductivity and fire resistance Good corrosion and wear resistance Very good electric insulation The alumina substrates also possess several unique features: Good ...
partially stabilised zirconia PSZ is a specific partially stabilised zirconia oxide substrate for thinfilm applications. This substrate material combines good electrical insulating properties (at room ...
KERAFOL Keramische Folien
... thin-film electronics applications. Our ADS-995 alumina substrates are an economical alternative for less-demanding thin-film applications. Substrate Size & Thickness SUBSTRATE ...
... substrates excel in the high frequency characteristics. Minituarization and high integration are possible by the multilayer wiring, the multi-cavity structure and the surgace/burried printing resistors. The special shapes ...
Substrate that enhances the weak Raman scattered light from the molecules The surface-enhanced Raman spectroscopy (SERS) substrate enhances the Raman scattering light from molecules, making high-sensitive ...
Hamamatsu offers ionization-assisting substrates called DIUTHAME that support ionization in mass spectrometry in place of matrix that is currently used for MALDI (Matrix-Assisted Laser Desorption/Ionization) and also ...
... Panasonic's new substrate material improves package-level reliability by reducing warpage during packaging (mounting chips on the IC substrate followed by an encapsulation process). The coefficient of ...
Your suggestions for improvement:
Receive updates on this section every two weeks.
Please refer to our Privacy Policy for details on how DirectIndustry processes your personal data.
- Brand list
- Manufacturer account
- Buyer account
- Our services
- Newsletter subscription
- About VirtualExpo Group
Please specify:
Help us improve:
remaining