LTCC substrate KLC series

for the electronics industrylow-temperature cofired

Features The substrates are suitable for the bare chip mounting, as the thermal expansion coefficient is close to silicon's, and dimension accuracy and flatness are excellent. By the uses of low dielectric-loss ceramics and low loss conductors, the substrates excel in the high frequency characteristics. Minituarization and high integration are possible by the multilayer wiring, the multi-cavity structure and the surgace/burried printing resistors. The special shapes of substrate and cavity such as circle shape, polygonal shape and concavo-convex shape are available. Thermal vias under bare chips can improve the thermal conductivity of the substrate. The substrates are outstanding in heat resistance and humidity resistance and non-occurence of outgas due to the ceramics used. Products meet EU-RoHS requirements. Applications Applications using high frequencies like micro-waves, milli-waves, etc. Applications used in harsh environment, especially in high temperatures, high humidities, etc. Various sensor packages. Multi chip modules for bare chips. MEMS packages. Interposer substrates.