Epoxy resin HB 300
sealingfor bondinghigh-temperature

Epoxy resin - HB 300  - WEICON - sealing / for bonding / high-temperature
Epoxy resin - HB 300  - WEICON - sealing / for bonding / high-temperature
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Characteristics

Type
epoxy
Applications
sealing, for bonding
Other characteristics
high-temperature

Description

WEICON HB 300 is pasty, steel-filled and high-temperature-resistant up to +200°C (392°F) (up to 280°C/536°F for a short period of time). It is processed with a mixing ratio of 1:1. The epoxy resin system is also suitable for applications on vertical surfaces and can be used for the repair and bonding of cast and metal parts, for filling in blow holes, for repairing damage on containers, carriages and machine parts and for sealing pumps and pipes. The product can be used in mechanical and plant engineering, in equipment engineering, and in many other areas of industry.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.